Internet of Things/Cloud Services
UMC, Cadence collaborate on 3D-IC hybrid bonding reference flow
United Microelectronics Corporation, a global semiconductor foundry, and Cadence Design Systems, Inc. has announced that Cadence 3D-IC reference flow, featuring the Integrity 3D-IC Platform, has been certified for UMC’s chip stacking technologies, … Continued
Ubiik, Realtek announce Nimbus 220 for upper 700 MHz A block for utilities, IoT applications
Ubiik, a vendor for AMI and end-to-end private LTE solution, has joined forces with Realtek Semiconductor Corporation, a semiconductor company and a Wi-Fi chip vendor by revenue, to deliver Nimbus … Continued
ResGreen announces new REST API for BotWay software, other updates
ResGreen Group International, Inc., a mobile robot and software solutions company, has unveiled a new Application Programming Interface (API) for its BotWay software that uses REST, an architectural style that … Continued
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