Platforms & Applications
HFCL launches open source Wi-Fi 7 access points at India Mobile Congress
New Delhi, India – HFCL Limited, the high-tech enterprise and integrated communication product and solution provider in collaboration with Qualcomm Technologies, Inc. launches open source Wi-Fi 7 access points under its IO product … Continued
C3Nano announces Activegrid room temperature curing conductive ink
Hayward, United States – C3Nano, Inc., the performance provider in nanowire-based technologies and conductive inks, announced a new formulation that can be cured rapidly at ambient conditions to produce conductive coatings … Continued
TNS launches smart SIM capability for global wireless access in North America
Processors, ISOs and merchants across North America can now benefit from Transaction Network Services’ (TNS) enhanced multi-carrier wireless connectivity for payment devices, point-of-sale terminals and ATMs thanks to the launch … Continued
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