CMOS
Kyocera to build a new plant in Kagoshima, Japan, for ceramic microelectronic packages
Kyocera Corporation announced that it will construct a new manufacturing plant on the premises of its Kagoshima Sendai manufacturing complex to increase production of ceramic microelectronic packages.
ASUS uses Infineon REAL3 image sensor chip to bring Augmented Reality into compact smartphones
The REAL3™ image sensor chip from Infineon Technologies AG has been incorporated in the new Augmented Reality (AR) smartphone by ASUS.